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Custom Application

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    Contact Us
    Address:Rm. 2-20901, Tsinghua Science Park, Technology Road 65, High-tech District, Xi'an, Shaanxi Province, China, 710075
    Tel:86-029-8844 4525
    86-029-8868 8901
    Fax:86-029-8868 8683
    E-mail:Sales@wismanhv.com

    EC

    Power(W):13
    Maximum output voltage(KV):2

    introduction:

    1、Improves efficiency and wafer throughput three times that of ordinary power supplies;

    2、Reduce backside gas errors, improve throughput and eliminate wafer stick/burst problems;

    3、Control parameters such as overcurrent, presence of wafer and wafer clamp thresholds, clamp voltage, offset voltage, and internal or external amplitude/offset controls;

    4、The versatility of amplitude/offset and output control during adjustment;

    5、Control output using rear panel I/O, serial computer commands, or front panel controls;

    6、Configuration of custom clamp and clamp removal sequence and waveform;

    7、Lockable front panel control interface;

    8、Supports Coulombic and Johnsen-Rahbek ESC technologies

    9、This section describes how to upload the configuration file of an electrostatic chuck to the device and store it in the device using a user-friendly software interface;

    10、Wafer detection includes wafer free, wafer presence, or wafer clamped state



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Product introduction

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Wisman's EC series of software-driven electrostatic sucker power supplies provide a range of features to meet a wide range of demanding applications. The instrument uses Wisman amplifier technology, which has been shown to increase efficiency and throughput by up to three times that of other power sources. Reduce backside gas errors, improve throughput and eliminate wafer stick/burst problems; Control parameters such as overcurrent, presence of wafer and wafer clamp thresholds, clamp voltage, offset voltage, and internal or external amplitude/offset controls; The versatility of amplitude/offset and output control during adjustment; Control output using rear panel I/O, serial computer commands, or front panel controls; Configures custom clamp and clamp removal sequences and waveforms. The versatile and trusted performance of Wisman's EC allows for use in multiple unique tools and processes without adding new costs to each unique tool or process in the facility.

 

Product features:

Lockable front panel control interface;

Each unit is provided with a traceable calibration certificate;

Supports Coulombic and Johnsen-Rahbek ESC technologies;

This section describes how to upload the configuration file of an electrostatic chuck to the device and store it in the device using a user-friendly software interface;

Wafer detection includes wafer free, wafer presence, or wafer clamped state;


Application:

Electrostatic driven material handling

Semiconductor wafer processing

Non-mechanical transfer of flat plates or other processed materials sensitive to mechanical handling


Feature:

Input: DC24V, 2A;

Output:

Output phase

Output voltage A (reference phase) : 0 to ±2 kV

Output voltage B (B phase =[-1] x A phase) : 0 to ±2kV

Output voltage range: 0 to ±2 kV DC, maximum

Output current: 0 to ±6.5 mA DC, peak capacity is 10 mA

Voltage display:

Ratio: 1V/ 200 V

B phase DC: Accuracy better than 0.5% of full scale

Offset voltage: less than 10 millivolts

Output noise: less than 50 mV rms

Current display:

Ratio :1 V/100 uA

Dc accuracy :±5 uA

Output noise: less than 50 mV rms

Operating conditions:

Temperature: 0 to 35°C (32 to 104°F)

Relative humidity: up to 85%, no condensation

Altitude: Up to 2,000 m (6,561.68 ft)

Dimensions: H x W x D 44 x 431.8 x 531.9 mm (3.47 x 17 x 20.9 in) in a 1U chassis

Weight: 3.86kg (8.5 lb)

Dc input socket: 2.0mm locking DC jack; The center is positive and the shell is negative (socket with Switchcraft S761K plug)

There are ground sockets, there are ground bolts.


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